QFN MLF Surface Mount Component to Breadboard Adapters

These adapters consist of a printed circuit board with SMT pads connected to a pins spaced on 0.1 inch (2.54mm) centers for mounting on standard prototype breadboards. All pins and pads are wired one to one.

Adapters on these pages are listed in ascending order by the number of pins   

10 Pads	16 Pads	20 Pads	24 Pads	28 Pads	32 Pads	38 Pads
40 Pads	44 Pads	48 Pads	52 Pads	56 Pads	64 Pads

Part Number		Multiple IC Pads	Price	Shopping Cart
BBA-QFN-32-80		Multiple QFN chip pads to breadboard adapter. Supports 32, 40, 48, 56, 64, 72, or 80 QFN pads at 0.5mm (20 mil) Pitch, from 5.0mm to 14.0mm Tip to tip. 2.54 mm, (0.10 inch) Breadboard hole pattern 0.5mm (20 mil) Pitch for 32, 40, 48, 56, 64, 72, 80, QFN SMT pads 5.0mm to 14mm Tip to tip Size 1.6 x 1.6 inches	$35.00

Part Number		10 Pad	Price	Shopping Cart
10QFN20-D6-SMT-S		10 pad QFN SMT to DIP breadboard adapter converts SMT package with pitch of 0.5mm to two 600 mil DIP pin rows. QFN Package type 10Pins 0.5mm (20 mil) Pitch device 2.54mm (100 mil) Package DIP rows are 600 mills apart	$8.00

Part Number		16 Pad	Price	Shopping Cart
16QFN20-D3-SMT-S		16 Pad QFN SMT to DIP breadboard adapter converts SMT package with pitch of 0.5mm to two 300-mil DIP pin rows. QFN Package type 16 Pins 0.5mm (20 mil) Pitch device 4.0mm Package DIP rows are 300 mills apart	$8.00
16QFN26-D3-SMT-S		16 Pad QFN MLF SMT to DIP breadboard adapter converts SMT package with pitch of 0.65mm to two 300-mil DIP pin rows. Microprocessors: PIC16F610, PIC16HV610, PIC16F616, PIC16HV616, PIC16F684, PIC16F688 QFN Package type 16 Pins 0.65mm Pitchdevice 4.0mm Package DIP rows are 300 mills apart	$8.00
16QFN39-D6-SMT-S		16 pad QFN MLF SMT to DIP breadboard adapter converts SMT package with pitch of 1.0 mm to two 600 mil DIP pin rows. QFN Package type 16 Pins 1.0 mm Pitch (39 mil)device 6.0mm Package DIP rows are 600 mills apart	$8.00

Part Number		20 Pad	Price	Shopping Cart
20QFN20L-D3-SMT-S		20 Pad QFN MLF SMT to DIP breadboard adapter converts the SMT package with pitch of 0.5mm to two rows 300-mil apart DIP pins. Center pin of the QFN on the side which faces pins 1 and 20 on the DIP is connected to pin 1 on the DIP. QFN Package type 20 Pins 0.5mm (20 mil) Pitch device 4.0mm Package DIP rows are 300 mills apart	$10.00
20QFN20R-D3-SMT-S		20 Pad QFN MLF SMT to DIP breadboard adapter converts the SMT package with pitch of 0.5mm to two rows 300-mil apart DIP pins. Center pin of the QFN on the side which faces pins 1 and 20 on the DIP is connected to pin 20 on the DIP. QFN Package type 20 Pins 0.5mm (20 mil) Pitch device 4.0mm Package DIP rows are 300 mills apart	$10.00
20QFN20SL-D3-SMT-S		20 Pad QFN SMT to DIP breadboard adapter converts the SMT package with pitch of 0.5mm to two rows 300-mil apart DIP pins. The center QFN pin on the side that faces pins 1 and 20 on the DIP is connected to pin 1 on the DIP. QFN Package type 20 Pins 0.5mm (20 mil) Pitch device 4.0mm x 3.0mm Package 4 QFN pads on the 3.0mm side 6 QFN pads on the 4.0mm side DIP rows are 300 mills apart	$10.00
20QFN26-D6-SMT-S-L		20 Pad QFN MLF SMT to DIP breadboard adapter converts the SMT package with pitch of 0.65mm to two rows 600 mil apart DIP pins. QFN Package type 20 Pins 0.65mm (26 mil) Pitch device 6.9.0mm (0.27 inch) maximum package DIP rows are 600 mills apart	$10.00

Part Number		24 Pad	Price	Shopping Cart
24QFN16-D6-SMT-S		24 Pad QFN MLF SMT to DIP breadboard adapter converts the SMT package with pitch of 0.4mm to two rows 600-mil apart DIP pins. QFN Package type 24 Pins 0.4mm Pitch device 2.25mm Package DIP rows are 600 mills apart	$12.00
24QFN20-D6-SMT-S		24 Pad QFN MLF SMT to DIP breadboard adapter converts the SMT package with pitch of 0.5mm to two rows 600-mil apart DIP pins. QFN Package type 24 Pins 0.5mm (20 mil) Pitch device 4.0mm Package DIP rows are 600 mills apart	$12.00

Part Number		28 Pad	Price	Shopping Cart
BB28MLF20-D6-SMT-S		For SMT devices in 28-MLF, 28QFN package to 600-mil DIP plug. Additional via holes for additional components, wire wrap, or test pins. Top pattern for 28 MLF & QFN Bottom Dual DIP rows 600 mil apart Size 1.3 x 1.4 inches Hole diameter 21 mil	$21.00
28QFN20-D6-SMT-S		28 PadQFN MLF SMT to DIP breadboard adapter converts the SMT package with pitch of 0.5mm to two rows 600-mil apart DIP pins. QFN Package type 28 Pins 0.5mm (20 mil) Pitch device 5.0mm Package DIP rows are 600 mills apart	$14.00
BB28QFN20-D6-SMT-S		28 Pad QFN MLF SMT to DIP breadboard adapter converts the SMT package with pitch of 0.5mm to two rows 600-mil apart DIP pins and 56 additional breadboarding pins. QFN Package type 84 Pins 0.5mm (20 mil) Pitch device 5.0mm Package Inside DIP rows are 600 mills apart	$21.00
28QFN26-D6-SMT-S		28 Pad QFN MLF SMT to DIP breadboard adapter converts the SMT package with pitch of 0.65mm to two rows 600-mil apart DIP pins. QFN Package type 28 Pins 0.65mm Pitch device 7.0mm Package DIP rows are 600 mills apart	$14.00

Part Number		32 Pad	Price	Shopping Cart
32QFN20-D6-SMT-S		32 Pad QFN MLF SMT to DIP breadboard adapter converts the SMT package with pitch of 0.5mm to two rows 600-mil apart DIP pins. QFN Package type 32 Pins 0.5mm (20 mil) Pitch device 5.0mm Package DIP rows are 600 mills apart	$16.00
32QFNR20-D6-SMT-S		32 Pad QFN MLF Rectangular SMT to DIP breadboard adapter converts rectangular 32 QFN MLF SMT package with 0.5mm, 6 and 10 pins per side to a 600-mil DIP component. QFN Rectangular Package type 32 Pins 0.5 mm Pitch device 5.0 x 7.0 mm Package DIP rows are 600 mills apart	$19.00
32QFN26-D6-SMT-S		32 Pad QFN MLF SMT to DIP breadboard adapter converts the SMT package with pitch of 0.65mm to two rows 600-mil apart DIP pins. QFN Package type 32 Pins 0.65mm Pitch device 7.0mm Package DIP rows are 600 mills apart	$16.00

Part Number		38 Pad	Price	Shopping Cart
38QFNR20-D6-SMT-S		38 pad QFN MLF SMT to DIP breadboard adapter converts the SMT package with pitch of 0.5mm to two rows 600-mil apart DIP pins. QFN Package type 38 Pins 0.5mm (20 mil) Pitch device 5.0 x 7.0mm Package DIP rows are 600 mills apart	$19.00

Part Number		40 Pad	Price	Shopping Cart
40QFN16-D6-SMT-S		40 Pad QFN MLF SMT to DIP breadboard adapter converts the SMT package with pitch of 0.4mm to two rows 600-mil apart DIP pins. QFN Package type 40 Pins 0.4mm Pitch device 5.0 x 5.0mm Square Package DIP rows are 600 mills apart	$20.00
40QFN20-D6-SMT-S		40 pad QFN to DIP breadboard adapter converts QFN package with pitch of 0.5mm to two 600-mil DIP pin rows. 40 Pins 0.5mm Pitch device 6.0 x 6.0mm Square Package DIP rows are 600 mills apart	$20.00

Part Number		44 Pad	Price	Shopping Cart
44QFN20-D6-SMT-S		44 pad QFN MLF SMT to DIP breadboard adapter converts the SMT package with pitch of 0.5mm to two rows 600-mil apart DIP pins. QFN Package type 44 Pins 0.5mm (20 mil) Pitch device 7.0mm Package DIP rows are 600 mills apart	$22.00
44QFN26-D6-SMT-S		44 Pad QFN MLF SMT to DIP breadboard adapter converts the SMT package with pitch of 0.65mm to two rows 600-mil apart DIP pins. QFN Package type 44 Pins 0.65mm Pitch device 8.0mm Package DIP rows are 600 mills apart	$22.00

Part Number		48 Pad	Price	Shopping Cart
48QFN16-D6-SMT-S		48 pad QFN MLF SMT to DIP breadboard adapter converts the SMT package with pitch of 0.4mm to two rows 600-mil apart DIP pins. QFN Package type 48 Pins 0.4mm Pitch device 6.0 x 6.0mm Square Package DIP rows are 600 mills apart	$24.00
48QFN16-PG-SMT-S		48 pad QFN MLF SMT breadboard adapter converts the SMT package with pitch of 0.4mm to 0.1 inch pin grid array. QFN Package type 48 Pads 0.4 Pitch device 5.0mm Square Package Pin grid array pins are 0.1 inch apart	$24.00
48QFN20-D6-SMT-S		48 Pad QFN, MLF, QFP, TQFP SMT to DIP breadboard adapter converts the SMT package with pitch of 0.5mm to two rows 600-mil apart DIP pins. QFN QFP & TQFP Package types 48 Pins 0.5mm (20 mil) Pitch device 7.0mm Package DIP rows are 600 mills apart	$24.00
48QFN20-PG-SMT-S		48 Pad QFN MLF SMT breadboard adapter converts the SMT package with pitch of 0.5mm to 0.1 inch pin grid array. QFN Package type 48 Pads 0.5mm (20 mil) Pitch device 7.0mm Package Pin grid array pins are 0.1 inch apart	$24.00
Y48QFN26-52UBI-SMT		48 Pad QFN MLF SMT Pads to 50 mil header connections. QFN Package type 48 Pads to via headers that are on 1.27 (50 mil) centers 0.65mm (26 mil) Pitch device IC tip to tip 12.6mm (495 mil) maximum	$19.00

Part Number		52 Pad	Price	Shopping Cart
52QFN16-UBI-SMT		52 pad QFN SMT to DIP breadboard adapter converts SMT package with pitch of 0.5mm to two 600 mil DIP pin rows. 7x7mm QFN Package 52 Pads 0.4mm (16 mil) Pitch device Pin to pin connection headers on 50 mil centers	$19.00

Part Number		56 Pad	Price	Shopping Cart
56QFN16-D9-SMT-S		56 pad QFN MLF SMT to DIP breadboard adapter converts the SMT package with pitch of 0.5mm to two rows 900-mil apart DIP pins. QFN Package type 56 Pins 0.4mm Pitch device 7.0mm Package DIP rows are 900 mills apart	$28.00
56QFN16-PG-SMT-S		56 pad QFN MLF SMT breadboard adapter converts the SMT package with pitch of 0.4mm to 0.1 inch pin grid array. QFN Package type 56 Pads 0.4mm Pitch device 7.0mm Package Pin grid array pins are 0.1 inch apart	$28.00
56QFN20-D9-SMT-S		56 Pad QFN MLF SMT to DIP breadboard adapter converts the SMT package with pitch of 0.5mm to two rows 900-mil apart DIP pins. QFN Package type 56 Pins 0.5mm (20 mil) Pitch device 8.0mm Package DIP rows are 900 mills apart	$28.00
56QFN20-PG-SMT-S		56 pad QFN MLF SMT breadboard adapter converts the SMT package with pitch of 0.5mm to 0.1 inch pin grid array. QFN Package type 56 Pads 0.5mm (20 mil) Pitch device 8.0mm Package Pin grid array pins are 0.1 inch apart	$28.00

Part Number		64 Pad	Price	Shopping Cart
64QFN20-PG-SMT-S		64 pad QFN MLF SMT breadboard adapter converts the SMT package with pitch of 0.5mm to 0.1 inch pin grid array. QFN Package type 64 Pads 0.5mm (20 mil) Pitch device 9.0mm Package Pin grid array pins are 0.1 inch apart	$32.00

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