Quarter Size Outline Package - QSOP Surface Mount Component to Breadboard Adapters

These adapters consist of a printed circuit board with SMT pads connected to a pins spaced on 0.1 inch centers for mounting on standard prototype breadboards. All pins and pads are wired one to one.

16 Pins	20 Pins	24 Pins	28 Pins
40 Pins	52 Pins	56 Pins

Part Number		16 Pad	Price	Shopping Cart
16QSO-D3-SMT-S		16 pad QSOP package to DIP breadboard adapter converts SMT package with pitch of 25 mils to two 300 mil DIP pin rows. QSOP Package Type 16 Pins 25 mils Pitch device Inside pads span 130 mils Outside pads span 250 mils DIP rows are 300 mills apart	$8.00

Part Number		20 Pad	Price	Shopping Cart
20QSO-D3-SMT-S		20 pad QSOP package to DIP breadboard adapter converts SMT package with pitch of 25 mils to two 300 mil DIP pin rows. QSOP Package Type 20 Pins 25 mils Pitch device Inside pads span 130 mils Outside pads span 250 mils DIP rows are 300 mills apart	$10.00

Part Number		24 Pad	Price	Shopping Cart
24QSO-D3-SMT-S		24 pad QSOP package to DIP breadboard adapter converts SMT package with pitch of 25 mils to two 300 mil DIP pin rows. QSOP Package Type 24 Pins 25 mils Pitch device Inside pads span 130 mils Outside pads span 250 mils DIP rows are 300 mills apart	$12.00

Part Number		28 Pad	Price	Shopping Cart
28QSO-D3-SMT-S		28 pad QSOP package to DIP breadboard adapter converts SMT pitch 25 mils pitch to two 300 mil DIP pin rows. QSOP Package Type 28 Pins 25 mils (0.635mm) Pitch device IC body width 155 mils (3.94mm) Inside pads span is 130 mils Outside pads span is 250 mils DIP pins are 18 mil round gold plate DIP rows are 300 mills apart	$14.00

Part Number		48 Pad	Price	Shopping Cart
48QSO-D6-SMT-S		48 pad QSOP package to DIP breadboard adapter converts SMT package with pitch of 25 mils to two 600 mil DIP pin rows. QSOP Package Type 48 Pins 25 mils Pitch device Inside pads span 300 mils Outside pads span 460 mils DIP rows are 600 mills apart	$14.00

Part Number		52 Pad	Price	Shopping Cart
52QSO-D9-SMT-S		52 pad QSOP package to DIP breadboard adapter converts SMT package with pitch of 0.635mm, (25 mils), to DIP pin rows 900 mils apart. QSOP Package Type 52 Pins 0.635mm (25 mils) Pitch device Tip to tip lead minimum is 320 mils Tip to tip maximum is 480 DIP rows are 900 mills apart on 100 mil centers.	$24.00

Part Number		56 Pad	Price	Shopping Cart
56QSO-D9-SMT-S		56 pad QSOP package to DIP breadboard adapter converts SMT package with pitch of 0.635mm, (25 mils), to DIP pin rows 900 mils apart. QSOP Package Type 56 Pins 0.635mm (25 mils) Pitch device Tip to tip lead minimum is 280 mils Tip to tip maximum is 720 DIP rows are 900 mills apart on 100 mil centers.	$28.00

Aprilog is a Division of Enable Engineering Co., Inc.