Aprilog makes & stocks IC adapters for QFP, TQFP, QFN, MLF, SOIC, SSOP, TSSOP, TSOP, VSOP, SOP, PLCC, PGA & SOT packages and stocks test sockets by Enplas, Plastronics, Sensata, Yamaichi & Tokyo Electech. Programming adapters, IC footprint chip changing adapters, and ZIF socket to PCB pads adapters. Adapters for Microchip PIC, Intel, NXP, ST, Freescale, and many more. We also build custom adapters to meet your special needs.

SSSOP Surface Mount Component to Breadboard Adapters

These adapters consist of a printed circuit board with SMT pads connected to a pins spaced on 0.1 inch centers for mounting on standard prototype breadboards. All pins and pads are wired one to one.

Adapters on these pages are listed in ascending order by the number of pins   
8 Pins 10 Pins
16 Pins 24 Pins


Part Number   8 Pad    Price Shopping Cart
8SSSO-D3-SMT-S 8 pad SSSOP package to DIP breadboard adapter converts SMT package with pitch of 0.4mm to two 300 mil DIP pin rows. 8 pad SSSOP package to DIP breadboard adapter converts SMT package with pitch of 0.4mm to two 300 mil DIP pin rows.
  • SSSOP Package Type
  • 8 Pins
  • 0.4mm Pitch device
  • DIP rows are 300 mils apart
$4.00

Part Number   10 Pad    Price Shopping Cart
10SSSO-D3-SMT-S 10 pad SSSOP package to DIP breadboard adapter converts SMT package with pitch of 0.4mm to two 300 mil DIP pin rows. 10 pad SSSOP package to DIP breadboard adapter converts SMT package with pitch of 0.4mm to two 300 mil DIP pin rows.
  • SSSOP Package Type
  • 10 Pins
  • 0.4mm Pitch device
  • DIP rows are 300 mils apart
$5.00

Part Number   16 Pad    Price Shopping Cart
16SSSO-D3-SMT-S 16 pad SSSOP package to DIP breadboard adapter converts SMT package with pitch of 0.4mm to two 300 mil DIP pin rows. 16 pad SSSOP package to DIP breadboard adapter converts SMT package with pitch of 0.4mm to two 300 mil DIP pin rows.
  • SSSOP Package Type
  • 16 Pins
  • 0.4mm Pitch device
  • DIP rows are 300 mils apart
$8.00

Part Number   24 Pad    Price Shopping Cart
24SSSO-D3-SMT-S 24 pad SSSOP package to DIP breadboard adapter converts SMT package with pitch of 0.4mm to two 300 mil DIP pin rows. 24 pad SSSOP package to DIP breadboard adapter converts SMT package with pitch of 0.4mm to two 300 mil DIP pin rows.
  • SSSOP Package Type
  • 24 Pins
  • 0.4mm Pitch device
  • DIP rows are 300 mils apart
$12.00


      Specs Discounts Delivery

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