These adapters consist of a highest quality ZIF test socket connected to a circuit card with pins spaced on 0.1 inch centers for mounting on standard prototype breadboards. All pins and pads are wired one to one.
Adapters on these pages are listed in ascending order by the number of pins
6 Pin PIC10F200, PIC10F204, PIC10F202
PIC10F206 SO23 6 pin to 8 DIP adapter. DIP pins have the same signals as the DIP version of the chip. SO-23 ZIF socket. Adapts from SO-23 package to PIC10F20x DIP socket.
6 Pin PIC10F200, PIC10F204, PIC10F202
PIC10F206 SO23 6 pin to 8 DIP adapter. DIP pins have the same signals as the DIP version of the chip. SO-23 ZIF socket. Adapts from SO-23 package to PIC10F20x DIP socket.
Bottom DIP pins are round, 18 mil diameter, solder tail and are DIP rows 300 mils apart. Pins are wired signal to signal from PIC10F20x SO-23 to DIP pins.
20 Pin PLCC adapter for PLCC packages. Dead-bug insertion autoeject socket, i.e. The package is inserted upside down with the cut corner to the right. Accepts plastic packages only. This adapter is wired one-to-one
Bottom pins are 18 mil round solder pins and DIP rows are 600 mils apart
$270.00
32QFN26-D3-ZL-S
32 Contact Generic QFN MLF programming adapter for devices in 0.65mm pitch 32-lead QFN MLF package. This QFN adapter has 300 mil wide DIP plug with 18 mil round, solder-tail pins for plugging into 300 mil wide production DIP sockets or 0.1 inch pattern standard breadboards.
Pins are round solder-tail 0.46mm (18 mil) diameter
Breadboard pins are arranged in 11 x 11 matrix on 0.10 inch centers
$350.00
56TS09-D9-ZO-S
56 Contact ZIF Test socket for TSOP type 2 package to DIP breadboard adapter. Converts SMT package with pitch of 5mm to two 900 mil DIP DIP Pin rows. DIP pin 1 is connected to TSOP pin 15 and DIP pin 56 is connected to TSOP pin 14 so that this adapter can be plugged directly into a DIP socket for the same chip in a DIP package.
Pin 1 is connected to TSOP pin 15 and DIP pin 56 is connected to TSOP pin 14.
Pins are round solder-tail 0.46mm (18 mil) diameter
DIP rows are 900 mills apart
$153.00
56TS20-D9-ZO-S
56 Contact ZIF Test socket for TSOP package to DIP breadboard adapter converts SMT package with pitch of 5mm to two 900 mil DIP DIP Pin rows. DIP pin 1 is connected to TSOP pin 15 and DIP pin 56 is connected to TSOP pin 14 so that this adapter can be plugged directly into a DIP socket for the same chip in a DIP package.